Produkter / Vision /
 | NEXIV FOUP
Ladda ner pdf (Öppnas i nytt fönster) | Non-contact, fully automated wafer carrier measuring system.
Provides all dimensional measurements required for wafer carrier fabrication including control of deformation due to aging of wafer carriers.
The NEXIV VMR-C4540 - designed for use with 300mm Front Opening Unified Pod (FOUP) & Front Opening Shipping Box (FOSB) wafer carriers - detects hard to see edges using a variety of illumination features as well as Nikon's unique image processing technologies. By incorporating laser AF that provides quick non-contact focusing, even on transparent surfaces and on the edge of the peripheries of the wafer, the VMR-C4540 is able to measure SEMI-standard dimensions with excellent accuracy.
Key features
• Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments
• SEMI-compliant kinematic plate provides perfect X,Y,Z coordinates
• Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes
• Laser AF provides fast, non-contact measurements of wafer positions
• Wide area, high-intensity LED illumination enables accurate measurements of wafer heights
• 300mm, 200mm wafer carrier and SMIF Pod base
Applications
• Wafers
|
|
|
